Tile levelling device

ABSTRACT

A tile levelling and spacing device ( 12 ) including: a base plate ( 20 ) having an upper surface ( 29 ) and a base surface; a central hub ( 22 ) which includes a stem aperture, each centrally located in the base plate ( 20 ), the stem aperture including internal threading; and at least one spacer body ( 24 ) which extend outwardly from the upper surface ( 20 ) of the base plate ( 20 ), wherein the at least one spacer body ( 24 ) includes: at least one first engagement portion ( 25 ) which is configured to abut against a side of a first tile of a pair of adjacent tiles ( 16 ) and be spaced away from the side of the second tile of that pair of tiles ( 16 ); and at least one second engagement portion ( 25 ) which is configured to abut against a side of the second tile of the pair of adjacent tiles ( 16 ) and be spaced away from the side of the first tile of that pair of tiles ( 16 ).

FIELD OF THE INVENTION

The present invention generally relates to a tile levelling and spacingdevice. The invention is particularly applicable for spacing andlevelling floor or wall tiles and it will be convenient to hereinafterdisclose the invention in relation to that exemplary application.However, it is to be appreciated that the invention is not limited tothat application and could be used for any tiling or paving applicationthat requires one or more tiling or paving bodies used in aninstallation to be properly spaced apart from other tiling or pavingbodies and level with other tiling or paving bodies.

BACKGROUND OF THE INVENTION

The following discussion of the background to the invention is intendedto facilitate an understanding of the invention. However, it should beappreciated that the discussion is not an acknowledgement or admissionthat any of the material referred to was published, known or part of thecommon general knowledge as at the priority date of the application.

The installation of tiles on a wall or floor surface requires experienceand skill. Aesthetics require that each tile is properly spaced apart,aligned and level with adjoining tiles. However, positioning andlevelling a large number of tiles can be difficult. Skewed tiles andraised edges can result if a tile is not properly installed.Additionally, floor and wall tiles are adhered to a surface using anadhesive that has a curing time of about twenty four hours. Tiles maymove during that curing period if not properly held in place.

A number of tile spacing and levelling devices are available to assist atiler properly space and level tiles during installation.

One prior tile spacing device is taught in U.S. Pat. No. 7,257,926 B1.This patent discloses a tile levelling and spacing device which includesa circular base plate having two rigid spacing arms. The spacing armsare orientated in normal relation to one another forming an “X”-shape onthe base plate. A post having ratchet teeth is formed integrally withthe base plate at the center of the base plate. A disc is also providedwhich receives the post. The disc includes a pawl which preventsdisplacement of the disc away from the base plate. In use, preselectedcorners of four tiles are positioned in overlying relation to the baseplate and abut the spacer arms. The spacing arms space the tiles apartfrom one another a selected distance. The disc is positioned inoverlying relation to the four corners of the tiles so that it overliesand holds the tiles level between the base plate and the disc. The tilesare set in an adhesive. After curing of the adhesive, an installertwists the disc in a plane parallel to the tiles until the post breaksoff.

Another prior tile spacing device is taught in British PatentPublication GB2460429A. This patent publication teaches a tile clampingand levelling device having a square base plate, a square top plate anda clamping means, such as a ratchet mechanism or twist-lock key, whichclamps the base plate and top plate together. The base plate includestwo rigid spacing arms formed on a top surface of the base plate. Thespacing arms are orientated in normal relation to one another to form an“X”-shape on the base plate. Again, in use, top plate is positioned inoverlying relation to four corners of a set of adjacent tiles so that itoverlies and holds the tiles level between the base plate and the topplate.

However, building regulation for some structures, such as high risebuildings, can require tile levelling and spacing devices to be removedfrom between tiles prior to filler material being applied betweenadjoining or adjacent tiles. The rationale for removal is that spacerscan create a mechanical connection between adjacent tiles. Thisconnection can transfer forces between the tiles, thereby increasing theprobability of damage from cracking or the like. Each of the abovedescribed prior tile levelling and spacing devices would not meet thisrequirement because the rigid spacing arms of these devices bridges thespace between adjacent tiles, and thereby create the undesiredmechanical connection between adjacent tiles.

It would therefore be desirable to provide an alternate tile levellingand spacing device which reduces and/or substantially overcomes theforegoing problem.

SUMMARY OF THE INVENTION

In a first aspect, the present invention provides a tile levelling andspacing device. The device includes a base plate which has an uppersurface and a base surface. The device also includes a central hub whichincludes a stem aperture, each centrally located in the base plate. Thestem aperture has internal threading. In addition, the device includesat least one spacer body that extends outwardly from the upper surfaceof the base plate. The spacer body or spacer bodies include at least onefirst engagement portion which is configured to abut against a side of afirst tile of a pair of adjacent tiles and be spaced away from the sideof the second tile of that pair of tiles; and at least one secondengagement portion which is configured to abut against a side of thesecond tile of the pair of adjacent tiles and be spaced away from theside of the first tile of that pair of tiles.

The spacer bodies of the present invention provide a combinedconfiguration which cooperating to extend the distance between and, inuse, space apart a pair of adjacent tiles. However, the engagementportions of the spacer bodies are not aligned. Any force from a pair oftiles is therefore not linearly transferred through the spacer body orbodies to the other tile.

In a first embodiment of the present invention, the spacer bodycomprises at least two bodies including at least one first spacer bodyand at least one second spacer body. The first spacer body includes atleast one first engagement portion. The second spacer body includes atleast one second engagement portion. In this embodiment, the spacerbodies are designed to space adjacent tiles apart from one another aselected distance without bridging the gap between those tiles. This isachieved by configuring the spacer bodies to abut the side of only onetile of a pair of adjacent tiles, and be spaced apart or away from theadjacent tile. It should be appreciated where there are three or moreadjacent tiles, the tile levelling and spacing device may includeadditional spacer bodies. The spacer bodies would provide at least onepair of spacer bodies between each adjacent pair of tiles of that groupof tiles which abut the side of one of that pair of tiles and be spacedaway from the side of the adjacent tile of that pair of tiles. Thisarrangement of spacer bodies does not form a mechanical connectionbetween adjacent tiles.

In an alternate embodiment of the present invention, at least one of thespacer bodies, and preferably most or all of the spacer bodies includesboth a first engagement portion and a second engagement portion. Each ofthe spacer bodies are therefore configured to extend the distancebetween and, in use, space apart a pair of adjacent tiles. The firstspacer portion and the second spacer portion of the spacer body orbodies are preferably laterally spaced apart relative to a longitudinalaxis of the base plate about which the central hub and each spacer bodyextends. Each of the spacer bodies is preferably flexible allowing thespacer bodies to flex when a load is applied by an abutting tile. Thus,while a mechanical connection is made between the two adjacent tiles,the flexibility of each of the spacer body reduces or limits thetransfer of force between these adjacent tiles.

In this alternate embodiment, the spacer bodies preferably comprise aplurality of spaced apart tabs, each tab having opposite ends, each endextend the distance between and, in use, configured to abut against arespective side of a pair of adjacent tiles. Each central hub and eachspacer body preferably extends laterally along a longitudinal axis ofthe base plate. Each tab preferably has a longitudinal side extendingbetween each end. In order to add further flexibility to theconfiguration, the longitudinal side each tab is preferably positionedat an angle relative to the longitudinal axis of the base plate. Theangle can be between 20 and 70 degrees, preferably between 30 and 50degrees, and is most preferably about 45 degrees.

The spacer bodies of each embodiment extend outwardly, preferablygenerally perpendicularly outwardly, from the upper surface of the baseplate. Each spacer body is preferably flexible and can be configured tobend and/or flex relative to the base plate. In some cases, each spacerbody is configured to transversely bend and/or flex relative to alongitudinal or transverse axis that the respective spacer body isaligned. This flexibility allows the spacer bodies to flex when a loadis applied by an abutting tile. Loaded parts of the tile levelling andspacing device, such as the spacer bodies, can therefore flex orotherwise move with that applied load. This reduces damage, such ascracks or the like, that may otherwise occur if the tile levelling andspacing device was constructed from a more rigid material.

In some embodiments, each spacer body is aligned parallel with at leastone of a longitudinal or a transverse axis of the base plate. The spacerbody may also be axially spaced apart from an adjacent spacer body aboutthat axis by an axial separation distance. Additionally, each spacerbody may also be radially spaced apart from an adjacent spacer bodyabout that axis by a particular spacer spacing.

The spacer bodies can have any suitable configuration. In preferredforms, the spacer bodies may comprise one or more of: tabs, flanges,rods, pimples, spigots, poles, fingers, ribs, flaps, fins, bars, panels,blocks, balls or teeth. In one embodiment, the spacer bodies comprise aplurality of tabs spaced apart lengthwise relative to a longitudinal ortransverse axis of the base plate. In another embodiment, the spacerbodies comprise a plurality of elongate bodies, preferably rods, alignedparallel with a longitudinal or a transverse axis of the base plate andaxially spaced apart relative to the respective longitudinal ortransverse axis of the base plate.

The dimensions of the spacer bodies can be optimised to minimisemechanical connection between two adjacent tiles. For example, thethickness of the spacer bodies can be selected to be less than ⅔ thetile spacing between adjacent tiles. More preferably, the thickness ofthe spacer bodies can be selected to be less than less than ½ the tilespacing between adjacent tiles. Similarly, the height of the spacerbodies relative to the upper surface of the base plate can be selectedto be less than the thickness of tiles the tile levelling and spacingdevice has been selected to be used to space and level. Preferably, theheight of the spacer bodies relative to the upper surface of the baseplate would be less than ⅔ the thickness of those tiles. Morepreferably, the height of the spacer bodies relative to the uppersurface of the base plate would be less than ½ the thickness of thosetiles.

The tile levelling and spacing device can be configured to fit betweenany number of adjacent tiles:

In some applications, the device is configured to fit between theparallel sides of two adjacent tiles. Here, the device would include atleast two pairs of spacer bodies, each spacer body being located onopposite sides of the central hub. In some cases, those pairs of spacerbodies located on opposite sides of the central hub would beequidistantly oriented at 180 degrees from each other about the centralhub.

In other applications, the device is configured to fit in the cornerbetween four adjacent tiles. Here, the device would include at leastfour pairs of spacer bodies, and at least four of those pairs of spacerbodies being equidistantly oriented at 90 degrees from each other aboutthe central hub.

In yet other applications, the device is configured to fit in the cornerbetween three adjacent tiles. Here, the device would include at leastthree pairs of spacer bodies oriented in a “T”-shaped configurationabout the central hub.

In each of the these configurations, each pair of spacer bodies locatedbetween respective pairs of adjacent tiles includes at least one firstspacer body and at least one second spacer body. The first spacer bodyis configured to abut against a side of a first tile of a pair ofadjacent tiles and be spaced away from the side of the second tile ofthat pair of tiles. The second spacer body is configured to abut againsta side of the second tile of the pair of adjacent tiles and be spacedaway from the side of the first tile of that pair of tiles.

The central hub can have any configuration in which the stem aperturecan be located. The central hub is preferably configured to bend and/orflex relative to the base plate. Furthermore, the width of the centralhub about the lengthwise axis of the base plate is preferably less thanthe spacing between adjacent tiles. These dimensions ensure the centralhub does not abut the sides of the tiles which in use abut the spacerbodies and thereby bridge the gap between those tiles.

The base plate can have any suitable configuration. In most embodiments,the base plate is a planar sheet having a selected shape. The plate canhave a circular or polygonal shape, for example a generally squareshape. The base plate preferably includes at least one opening, cut-outor aperture. These openings, cut-outs or apertures are configured toallow adhesive to pass through when the tile levelling and spacingdevice is in use. The adhesive can therefore directly join the tile tothe flooring or wall through that opening, cut-out or aperture.

The tile levelling and spacing device preferably comprises a flexibleand/or resilient material. The tile levelling and spacing device can bemanufactured from a variety of material including metals, such as forexample a metal such as iron or alloys thereof, aluminium, paper basedproducts such as cardboard, wood. However, the preferred material ofconstruction is a plastic. Suitable plastics include (but are notlimited to) polyethylene terephthalate (PET), polyethylene, Polyvinylchloride (PVC), High Impact Polystyrene (HIPS), virgin or recycledpolypropylene, nylons, polyesters, styrene based plastics,Polyvinylidene chloride (PVDC), polycarbonates or similar.

The levelling function of the tile levelling and spacing device isprovided in cooperation with a clamping device. The clamping devicepreferably includes a handle configured for manual manipulation by auser, a clamping surface attached to the handle configured to abut a topsurface of a tile, and a threaded tubular stem which perpendicularlyextends from the clamping surface and is configured to be threadablyreceived within the stem aperture of the central hub. A tile cantherefore be clamped between the upper surface of the base plate of thetile levelling and spacing device and the clamping surface of theclamping device.

According to a second aspect of the present invention, there is provideda method of installing a tile levelling and spacing device for spacingand levelling a plurality of tiles, comprising the following steps:

-   -   providing the tile levelling and spacing device according to the        first aspect of the present invention;    -   applying an adhesive onto a top surface of a floor or wall to        create an adhesive layer;    -   applying a first tile onto the adhesive layer; inserting the        tile levelling and spacing device on the adhesive layer and        under at least one side of a first tile;    -   applying additional tiles and additional tile levelling and        spacing device s onto the adhesive layer so that a tile        levelling and spacing device is located between and under at        least one side of all applied tiles;    -   adjusting a spacing gap width between adjacent tiles by aligning        the sides and/or corners of the tiles to abut the spacer body of        a respective adjacent tile levelling and spacing device;    -   inserting a clamping device to each tile levelling and spacing        device , the clamping device having handle and a threaded        tubular which perpendicularly extends from the handle, the stem        being threadably received within the stem aperture;    -   clamping each tile between the clamping device by means of        appropriate directional turning of clamping device for every        tile levelling and spacing device;    -   pressing all tiles firmly into the adhesive layer;    -   allowing the adhesive layer to dry;    -   removing clamping device from each tile levelling and spacing        device by means of appropriate directional turning of clamping        device until detached from the stem aperture.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will now be described with reference to thefigures of the accompanying drawings, which illustrate particularpreferred embodiments of the present invention, wherein:

FIG. 1 is a perspective view of a tile levelling and spacing device andcooperating clamping spindle according to a first preferred embodimentof the present invention.

FIG. 2 is a plan view of the tile levelling and spacing device shown inFIG. 1 inserted between two adjacent tiles.

FIG. 3 is a perspective view of a tile levelling and spacing device andcooperating clamping spindle according to a second preferred embodimentof the present invention.

FIG. 4 is a perspective view of a tile levelling and spacing deviceaccording to a third preferred embodiment of the present invention.

FIG. 5 is a perspective view of a tile levelling and spacing deviceaccording to a fourth preferred embodiment of the present invention.

FIG. 6 is a perspective view of a tile levelling and spacing deviceaccording to a fifth preferred embodiment of the present invention.

FIG. 7 is a perspective view of a tile levelling and spacing deviceaccording to a sixth preferred embodiment of the present invention.

DETAILED DESCRIPTION

Referring firstly to FIGS. 1 and 2, there is shown a tile levelling andspacing system 10 according to a first preferred embodiment of thepresent invention. The tile levelling and spacing system 10 comprises atile levelling and spacing device 12 and a clamping spindle 14. The tilelevelling and spacing device 12 and a clamping spindle 14 actcooperatively to clamp around a tile 16 (FIG. 2) when in use.

The illustrated tile levelling and spacing device 12 comprises agenerally square moulded body made of a plastic material fabricated in aplastic injection moulding process or similar. The device 12 includes arectangular base plate 20, a square central connection hub 22, and fourspacing tabs 24. The base plate 20, central connection hub 22 andspacing tabs are all integrally moulded as part of the device 12 duringa plastic moulding process. It should be appreciated that the dimensionsof the features of the device 12 can vary to suit a particular tile sizeand configuration without departing from the scope of the presentinvention.

The base plate 20 is a generally rectangular plastic plate whichincludes four spaced apart openings 26 and two side cut-outs 28configured to allow adhesive to pass through when the tile levelling andspacing device 12 is in use. It should be appreciated that none or anynumber of openings 26 and cut-outs 28 could equally be used withoutdeparting from the spirit and scope of the present invention.

The central connection hub 22 comprises a cubic body centrally locatedon the upper surface 29 of the base plate 20. The central connection hub22 includes a threaded stem aperture 30 which extends through thecentral hub 22 and base plate 30. The width of the central connectionhub 22 about axis X-X of the base plate 20 is less than the tile spacingD (FIG. 2) between adjacent tiles 16. These dimensions ensure thecentral connection hub 22 does not abut the sides of the tiles 16 andthereby bridge the gap between those tiles 16.

Four spacer tabs 24 are also provided which extend generallyperpendicularly outwardly from the upper surface 29 of the base plate20. Each spacer tab 24 comprises a thin rectangular tab having anengagement surface 25 which is configured to abut against a side of oneof the tiles 16 of an adjacent pair of tiles 16. The spacer tab 24 isalso spaced away from the other tile 16 of that pair of tiles 16 (FIG.2). Each spacer tab 24 therefore does not form a mechanical connectionbetween adjacent tiles 16. The distance between the outside faces ofadjacent spacer tabs 24 defines the desires tile spacing D between theadjacent tiles 16. As best shown in FIG. 2, each spacer tab 24 isaligned parallel with the transverse axis X-X of the base plate 20 andis spaced apart from an adjacent spacer tab 24 about that axis by aseparation distance G. Each of the adjacent spacer tabs 24 is alsoaxially spaced apart relative to the axis X-X. A small gap Z can beprovided between axially adjacent spacer tabs 24. However, it should beappreciated that this gap may not be present in some embodiments.

The height of the spacer tabs 24 is generally less than the thickness oftiles 16 the tile levelling and spacing device 12 has been selected tobe used to space and level. This ensures each spacer tab 24 is coveredby filler (such as grout) once that the space 27 (FIG. 2) between theadjacent tiles 16 is filled with that filler. In the illustratedembodiment, the height of the spacer tabs 24 is around 2/3 the thicknessof the tiles 16.

The plastic material the tile levelling and spacing device 12 isconstructed from is preferably selected to ensure each spacer tab 24 isflexible, and can transversely bend and/or flex relative to thetransverse axis X-X. Flexibility of the spacer tabs 24 allow the spacertabs 24 to flex when a load is applied by an abutting tile 16. Thethickness of the spacer tabs 24 also assists in this flexibility. In theillustrated embodiment, the thickness of the spacer tabs 24 is about 2/5the tile spacing D between adjacent tiles 16.

It should be appreciated that other forms of spacing bodies can also beused to achieve the same function as the spacer tabs 24 shown in FIG. 1.

For example, FIG. 3 illustrates a tile levelling and spacing system 10Aaccording to a second preferred embodiment of the present invention.This second system includes a similar tile levelling and spacing device12A to the tile levelling and spacing device 12 shown in FIGS. 1 and 2in which the spacer tabs 24 are substituted with a multitude of spacedapart flexible spacing rods 24A which are aligned parallel with thetransverse axis X-X of the base plate 20A and spaced apart lengthwiserelative to the respective transverse axis X-X. The spacing rods 24Ahave engagement surfaces 25A.

The tile levelling and spacing device 12 also includes a connectionspindle 14. The connection spindle 14 shown in FIGS. 1 and 3 includes acylindrical handle 40 configured for manual manipulation by a user. Thespindle 14 also includes a clamping disc 42 attached to the handle 40having a clamping surface 43 configured to abut a top surface of a tile16. A threaded tubular stem 44 is also provided which perpendicularlyextends from the clamping surface 43 and is configured to be threadablyreceived within the stem aperture 30, 30A of the central hub 22, 22A. Atile 16 can therefore be clamped between the upper surface 29 of thebase plate 20 of the tile levelling and spacing device 12 and theclamping surface 43 of the connection spindle 14 by inserting thetubular stem 44 of the connection spindle 14 into the stem aperture 30of the tile levelling and spacing device 12 and rotating the spindlerelative to the tile levelling and spacing device 12 to threadablytighten the clamping surface 43 and the upper surface 29 around thattile 16.

The tile levelling and spacing device 12 can be configured to fitbetween any number of adjacent tiles 16. The devices 20 and 20A shown inFIGS. 1 to 3 are configured to fit between two parallel sides ofadjacent tiles 16. These devices 20 and 20A include pairs of spacer tabs24, 24A which are equidistantly oriented at 180 degrees from each other.However, the tile levelling and spacing device 12 can also be configuredto level and space three adjacent tiles, four adjacent tiles or more.

FIG. 4 illustrates a further embodiment of a tile levelling and spacingdevice 112 according to the present invention configured to fit in thecorner between four adjacent tiles 16. This device 112 has similarfeatures as described for the tile levelling and spacing device 12illustrated and described in relation to FIG. 1, with the difference ofhaving four pairs of spacer tabs 124 being provided equidistantlyoriented at 90 degrees from each other around the central hub 122. Thespacing tabs 124 have engagement surfaces 125. In use, the four cornersof a set of four adjacent tiles are seated in the complementary recessesin the base plate 120 formed between the four pairs of spacer tabs 124,with each side of the relevant tiles abutting the adjacent four pairs ofspacer tabs 124. A clamping spindle 14, such as shown in FIGS. 1 and 3,is then applied so that the clamping disc 42 overlies and holds thetiles level between the clamping disc 42 and the base plate 120.

FIG. 5 illustrates a yet further embodiment of a tile levelling andspacing device 212 according to the present invention configured to fitin the corner between three adjacent tiles. This device 212 has similarfeatures as described for the tile levelling and spacing device 12Aillustrated and described in relation to FIG. 3, with the difference ofhaving three linear rows of spacer rods 224 oriented in a “T”-shapedconfiguration. The spacing rods 224 have engagement surfaces 225. Inuse, the three corners of a set of three adjacent tiles are seated inthe complementary recesses in the base plate 220 formed between theT-shaped arrangement of spacer tabs 224, with each side of the relevanttiles abutting the adjacent three pairs of spacer tabs 224. A clampingspindle 14, such as shown in FIGS. 1 and 3, is then applied so that theclamping disc 42 overlies and holds the tiles level between the clampingdisc 42 and the base plate 220.

FIG. 6 illustrates a yet further embodiment of a tile levelling andspacing device 312 according to the present invention configured to fitin between two adjacent tiles. This device 312 has similar features asdescribed for the tile levelling and spacing device 12 illustrated anddescribed in relation to FIG. 1, with the difference of having sixangled spacer tabs 324 being laterally aligned about and with thecentral hub 322 along axis X-X. Unlike the previous embodiments, each ofthe spacer tabs 324 are configured to extend the distance between and,in use, space apart a pair of adjacent tiles. Each spacer tab 324includes two spaced apart engagement surfaces 325, each of which isdesigned to abut against an opposing side of a tile of a pair of tiles(for example tiles 16 as shown in FIG. 2). Each of these engagementsurfaces 325 are laterally spaced apart along axis X-X. Each spacer tab324 is flexible allowing each spacer tab 324 to flex when a load isapplied by an abutting tile. Each tab is positioned at an angle, in theillustrated embodiment about 50 degrees, relative to the longitudinalaxis X-X of the base plate 320.

In use, the two sides of adjacent tiles are pushed to abut therespective sides of each angled spacer tab 324. A clamping spindle 14,such as shown in FIGS. 1 and 3, is then applied so that the clampingdisc 42 overlies and holds the tiles level between the clamping disc 42and the base plate 320.

FIG. 7 illustrates a further embodiment of a tile levelling and spacingdevice 412 according to the present invention configured to fit inbetween two adjacent tiles. This device 412 has similar features asdescribed for the tile levelling and spacing device 12 illustrated anddescribed in relation to FIG. 1, with the difference of having twocurved spacer ribs 424 laterally aligned with and spaced apart about thecentral hub 422 along axis X-X. Like the previous embodiment 312, eachof the spacer ribs 424 are configured to extend the distance betweenand, in use, space apart a pair of adjacent tiles 16. In this respect,each spacer rib 424 includes two spaced apart engagement surfaces 425,each of which is designed to abut against an opposing side of a tile ofa pair of tiles (for example tiles 16 as shown in FIG. 2). Again, theengagement surfaces 425 on each respective spacer rib 424 is laterallyspaced apart along axis X-X on each respective spacer rib 424. Any forcefrom one of the adjacent tiles is not linearly transferred through thespacer rib 424 to the other tile, but rather the spaced apart locationsof the engagement surfaces 425 allows that spacer rib 424 to flex when aload is applied by an abutting tile, therefore reduce force transfertherethrough.

In use, the two sides of adjacent tiles are pushed to abut therespective engagement surface 424 of each angled spacer tab 424. Aclamping spindle 14, such as shown in FIGS. 1 and 3, is then applied sothat the clamping disc 42 overlies and holds the tiles level between theclamping disc 42 and the base plate 420.

It is to be appreciated that all the embodiments of the present system10, 10A, and associated tile levelling and spacing devices, 12, 112,212, 312 and 412 may be produced in a variety of different sizes andconfigurations depending on the type of flooring material used and thedesired spacing gap 120 without departing from the scope of the presentinvention.

The illustrated levelling and spacing system 10 is used to level andspace adjacent tiles 16. The following steps are described in relationto the system 10 illustrated and described in FIGS. 1 and 2. However, itshould be appreciated that these steps can generally apply to each ofthe embodiments illustrated in FIGS. 3 to 5.

In order to use the device 12 shown FIGS. 1 and 2, a flooring or wallsurface is selected on which tiles 16 are to be applied. The surface iscleaned and prepared and than an adhesive is applied onto that surfaceto create an adhesive layer. A first tile is then applied onto theadhesive layer in a desired position. A first tile levelling and spacingdevice 12 is then inserted on the adhesive layer and under at least oneside of a first tile 16. One or more additional tiles are laid on theadhesive layer, including a second tile 16 adjacent to the first tile16, which is placed on top of the first tile levelling and spacingdevice 12. The first and second tiles are spaced apart a distance D(FIG. 2) by the spacing tabs 24 of the device 12. Additional tiles 16and additional tile levelling and spacing devices 12 can be applied ontothe adhesive layer so that a tile levelling and spacing device islocated between and under at least one side of all applied tiles 16. Thetile spacing distance D between adjacent tiles 16 can be adjusted byaligning the sides and/or corners of the tiles 16 to abut the spacertabs 44 of a respective adjacent tile levelling and spacing device 12.

A clamping spindle 14 is then attached to each first tile levelling andspacing device 12 by inserting the tubular stem 44 of the clampingspindle 14 into the stem aperture 30 of the tile levelling and spacingdevice 12. It should be appreciated that this insertion step could beundertaken prior to insertion of the tile levelling and spacing device12 under the tiles 16, or once the tile levelling and spacing device 12is in situ under the tiles 16. Each tile 16 is then clamped between thespindle 24 and tile levelling and spacing device 12 by rotating theclamping spindle 14 relative to the tile levelling and spacing device 12to threadably tighten the clamping surface 43 and the upper surface 29around that tile 16. All the tiles 16 are then pressed firmly into theadhesive layer, and the adhesive layer is allowed to dry. This can takearound 24 hours.

Once the adhesive is dry, the clamping spindle 14 is then from each tilelevelling and spacing device 12 by means of appropriate directionalturning of clamping spindle 14 until the tubular stem 44 is detachedfrom the stem aperture 30. A suitable filler material, such as grout,can be then inserted in the space 27 between the tiles 16.

Those skilled in the art will appreciate that the invention describedherein is susceptible to variations and modifications other than thosespecifically described. It is understood that the invention includes allsuch variations and modifications which fall within the spirit and scopeof the present invention.

Where the terms “comprise”, “comprises”, “comprised” or “comprising” areused in this specification (including the claims) they are to beinterpreted as specifying the presence of the stated features, integers,steps or components, but not precluding the presence of one or moreother feature, integer, step, component or group thereof.

1. A tile levelling and spacing device including: a base plate having anupper surface and a base surface; a central hub which includes a stemaperture, each centrally located in the base plate, the stem apertureincluding internal threading; and at least one spacer body that extendsoutwardly from the upper surface of the base plate. 2-25. (canceled)